Matteo Piccin

5 Patents

• US125506452026

  Method of Forming a Semiconductor Device Including an Absorption Layer

  Infineon Technologies AG

  0 cites
• US122495042025

  Manufacturing and Reuse of Semiconductor Substrates

  Infineon Technologies AG

  0 cites
• US119905202024

  Method of Manufacturing a Semiconductor Device Having Frame Structures Laterally Surrounding Backside Metal Structures

  INFINEON TECHNOLOGIES AG

  0 cites
• US117569172023

  Method for Processing a Semiconductor Wafer, Semiconductor Wafer, Clip and Semiconductor Device

  Infineon Technologies Austria AG

  0 cites
• US115762592023

  Carrier, Laminate and Method of Manufacturing Semiconductor Devices

  Infineon Technologies AG

  0 cites