Mathias Wendt

3 Patents

• US119618202024

  Method for Producing a Connection Between Component Parts, and Component Made of Component Parts

  OSRAM OLED GmbH

  0 cites
• US118429802023

  Method for Producing an Electronic Component, Wherein a Semiconductor Chip Is Positioned and Placed on a Connection Carrier, Corresponding Electronic Component, and Corresponding Semiconductor Chip and Method for Producing a Semiconductor Chip

  OSRAM Opto Semiconductors GmbH

  0 cites
• US115453692023

  Method of Fastening a Semiconductor Chip on a Lead Frame, and Electronic Component

  OSRAM OLED GmbH

  0 cites