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Mathew J. Manusharow
Phoenix, AZ
US
6 patents
8 Patents
US12094827
2024
Size and Efficiency of Dies
Intel Corporation
0 cites
US12094831
2024
High Density Interconnect Device and Method
Tahoe Research, Ltd.
0 cites
US12051651
2024
Size and Efficiency of Dies
Intel Corporation
0 cites
US12002745
2024
High Performance Integrated RF Passives Using Dual Lithography Process
Intel Corporation
0 cites
US11961804
2024
Size and Efficiency of Dies
Intel Corporation
0 cites
US11715695
2023
Size and Efficiency of Dies
Intel Corporation
0 cites
US11664320
2023
High Density Interconnect Device and Method
Tahoe Research, Ltd.
0 cites
US11608564
2023
Helical Plated Through-hole Package Inductor
Intel Corporation
0 cites