Patents/Inventors

Masayuki Iwasaki

AnnakaJP1 patent

2 Patents

US124214352025
Adhesive Composition for Flexible Printed-wiring Board (FPC), and Heat-curable Resin Film, Prepreg and FPC Substrate Containing Same
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US121460572024
Cyclic Imide Resin Composition, Prepreg, Copper-clad Laminate and Printed-wiring Board
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites