Patents/Inventors

Masayoshi Kamai

SuitaJP1 patent

2 Patents

US118726512024
Dissimilar Material Solid Phase Bonding Method, Dissimilar Material Solid Phase Bonded Structure, and Dissimilar Material Solid Phase Bonding Device
OSAKA UNIVERSITY
0 cites
US117452872023
Metal Material Solid-phase Bonding Method and Solid-phase Bonding Device
OSAKA UNIVERSITY
0 cites