4 Patents
- US126158232026Method of Manufacturing Silicon Carbide Semiconductor Device
MIRISE Technologies Corporation
0 cites - US125017122025Method of Forming Grooves and Vertical Cracks in a Wafer Comprising Individual Semiconductor Elements to Separate the Semiconductor Elements by Cleaving the Wafer Along the Grooves and the Vertical Cracks
MIRISE Technologies Corporation
0 cites - 0 cites
- US124263292025Silicon Carbide Semiconductor Device Including a Side Silicide Layer and Method for Manufacturing the Same
MIRISE Technologies Corporation
0 cites