Patents/Inventors

Masashi Okaniwa

TokyoJP6 patents

5 Patents

US125688482026
Film, Laminate, Semiconductor Wafer with Film Layer, Substrate for Mounting a Semiconductor with Film Layer, and Semiconductor Device
MITSUBISHI GAS CHEMICAL COMPANY, Inc.
0 cites
US125345592026
Resin Composition, Resin Sheet, Laminate, Semiconductor Wafer with Resin Composition Layer, Substrate for Mounting Semiconductor with Resin Composition Layer, and Semiconductor Device
MITSUBISHI GAS CHEMICAL COMPANY, Inc.
0 cites
US121955662025
Film, Laminate, Semiconductor Wafer with Film Layer, Substrate for Mounting Semiconductor with Film Layer, and Semiconductor Device
MITSUBISHI GAS CHEMICAL COMPANY, Inc.
0 cites
US119358032024
Resin Composition, Laminate, Semiconductor Wafer with Resin Composition Layer, Substrate for Mounting Semiconductor with Resin Composition Layer and Semiconductor Device
MITSUBISHI GAS CHEMICAL COMPANY, Inc.
0 cites
US119249792024
Resin Composition, Laminate, Semiconductor Wafer with Resin Composition Layer, Substrate for Mounting Semiconductor with Resin Composition Layer and Semiconductor Device
MITSUBISHI GAS CHEMICAL COMPANY, Inc.
0 cites