Patents/Inventors

Masaru Hatabe

KobeJP4 patents

5 Patents

US124486902025
Treatment Method After Plating with Sn or Sn Alloy
ISHIHARA CHEMICAL CO., Ltd.
0 cites
US123880352025
Structure Comprising Under Barrier Metal and Solder Layer, and Method for Producing Structure
ISHIHARA CHEMICAL CO., Ltd.
0 cites
US119938622024
Structure Including Copper Plating Layer or Copper Alloy Plating Layer
ISHIHARA CHEMICAL CO., Ltd.
0 cites
US119461532024
Copper or Copper Alloy Electroplating Bath
ISHIHARA CHEMICAL CO., Ltd.
0 cites
US119396912024
Tin or Tin Alloy Electroplating Bath, and Electronic Component Having Electrodeposit Formed Thereon Using the Plating Bath
ISHIHARA CHEMICAL CO., Ltd.
0 cites