Patents/Inventors

Masanori Shindo

YokohamaJP4 patents

5 Patents

US120948242024
Semiconductor Package and Method for Manufacturing Semiconductor Package
LAPIS Semiconductor Co., Ltd.
0 cites
US117423052023
Semiconductor Device and Manufacturing Method of Semiconductor Device
LAPIS SEMICONDUCTOR CO., Ltd.
0 cites
US116643142023
Semiconductor Package and Method for Manufacturing Semiconductor Package
LAPIS Semiconductor Co., Ltd.
0 cites
US116005892023
Semiconductor Device and Semiconductor Device Manufacturing Method
LAPIS SEMICONDUCTOR CO., Ltd.
0 cites
US115454522023
Semiconductor Device Bonding Area Including Fused Solder Film and Manufacturing Method
LAPIS SEMICONDUCTOR CO., Ltd.
0 cites