Patents/Inventors

Masamitsu Matsuura

BeppuJP12 patents

12 Patents

US125593632026
High Reliability Sensor
TEXAS INSTRUMENTS INCORPORATED
0 cites
US124127952025
Dual Down-set Conductive Terminals for Externally Mounted Passive Components
TEXAS INSTRUMENTS INCORPORATED
0 cites
US123344172025
Leaded Semiconductor Device Package Having Leads with Different Widths
TEXAS INSTRUMENTS INCORPORATED
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US122726262025
Conductive Members Atop Semiconductor Packages
TEXAS INSTRUMENTS INCORPORATED
0 cites
US122594452025
Hall Sensor Using Face Down Structure with Through Substrate Vias
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121602192024
Metal Ribs in Electromechanical Devices
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120741342024
Package for Stress Sensitive Component and Semiconductor Device
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120574172024
Wafer Chip Scale Package
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119423842024
Semiconductor Package Having an Interdigitated Mold Arrangement
TEXAS INSTRUMENTS INCORPORATED
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US119233202024
Semiconductor Device Having Tapered Metal Coated Sidewalls
TEXAS INSTRUMENTS INCORPORATED
0 cites
US118482442023
Leaded Wafer Chip Scale Packages
Texas Instruments Incorporated
0 cites
US117360852023
Metal Ribs in Electromechanical Devices
TEXAS INSTRUMENTS INCORPORATED
0 cites