Masamitsu Agari

6 Patents

• US122951742025

  Substrate Dividing Method Using an Expansion Tape and a Roller

  DISCO CORPORATION

  0 cites
• US116108152023

  Wafer Processing Method Including Uniting Wafer, Ring Frame, and Polyolefin Sheet Without Using an Adhesive Layer

  DISCO CORPORATION

  0 cites
• US115944542023

  Wafer Processing Method Including Uniting Wafer, Ring Frame and Polyolefin Sheet Without Using an Adhesive Layer

  DISCO CORPORATION

  0 cites
• US115878322023

  Wafer Processing Method Including Uniting Wafer, Ring Frame and Polyolefin Sheet Without Using an Adhesive Layer

  DISCO CORPORATION

  0 cites
• US115878332023

  Wafer Processing Method Including Uniting Wafer, Ring Frame, and Polyolefin Sheet Without Using an Adhesive Layer

  DISCO CORPORATION

  0 cites
• US115453932023

  Wafer Processing Method Including Uniting Wafer, Ring Frame and Polyester Sheet Without Using an Adhesive Layer

  DISCO CORPORATION

  0 cites