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Marvin L. Bernt
Kalispell, MT
US
5 patents
5 Patents
US12404597
2025
Electrochemical Depositions of Nanotwin Copper Materials
Applied Materials, Inc.
0 cites
US11987897
2024
Systems and Methods for Shielding Features of a Workpiece During Electrochemical Deposition
APPLIED Materials, Inc.
0 cites
US11973034
2024
Nanotwin Copper Materials in Semiconductor Devices
Applied Materials, Inc.
0 cites
US11901225
2024
Diffusion Layers in Metal Interconnects
Applied Materials, Inc.
0 cites
US11634830
2023
Electrochemical Depositions of Nanotwin Copper Materials
Applied Materials, Inc.
0 cites