Patents/Inventors

Martin W. Bayes

Hopkinton, MAUS2 patents

4 Patents

US120272812024
Metallic Structure with Desired Combinations of Mechanical and Electrical Characteristics
TE CONNECTIVITY SOLUTIONS GmbH
0 cites
US118590922024
Printable Non-curable Thixotropic Hot Melt Composition
TE CONNECTIVITY SOLUTIONS GmbH
0 cites
US118590932024
Printable Non-curable Thixotropic Hot Melt Composition
TE CONNECTIVITY SOLUTIONS GmbH
0 cites
US118431532023
Use of Enhanced Performance Ultraconductive Copper Materials in Cylindrical Configurations and Methods of Forming Ultraconductive Copper Materials
TE CONNECTIVITY SOLUTIONS GmbH
0 cites