Martin Henning Vielemeyer

2 Patents

• US123158352025

  Pre-packaged Chip, Method of Manufacturing a Pre-packaged Chip, Semiconductor Package and Method of Manufacturing a Semiconductor Package

  Infineon Technologies AG

  0 cites
• US121194002024

  Semiconductor Transistor Device and Method of Manufacturing the Same

  Infineon Technologies Austria AG

  0 cites