27 Patents
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- US124631162025Method for Fabricating a Semiconductor Device Including an Embedded Semiconductor Die
Infineon Technologies Austria AG
0 cites - US124380632025Electronic Module Including a Semiconductor Package Disposed on an Interposer Layer
Infineon Technologies Austria AG
0 cites - US123946972025Method for Fabricating a Semiconductor Device Package Comprising a Pin in the Form of a Drilling Screw
Infineon Technologies Austria AG
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- US123374052025Resistance Spot Welded Joint Comprising a Zinc Coated AHSS Steel Sheet
VOESTALPINE STAHL GmbH
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- US122180292025Semiconductor Device with Improved Performance in Operation and Improved Flexibility in the Arrangement of Power Chips
Infineon Technologies Austria AG
0 cites - US122180302025Electronic Module Comprising a Semiconductor Package with Integrated Clip and Fastening Element
Infineon Technologies Austria AG
0 cites - US121659592024Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing Method
Infineon Technologies AG
0 cites - US121548862024Semiconductor Packages Including Electrical Redistribution Layers of Different Thicknesses and Methods for Manufacturing Thereof
Infineon Technologies AG
0 cites - US121257722024Method of Forming a Semiconductor Package with Connection Lug
Infineon Technologies Austria AG
0 cites - US120806692024Semiconductor Device Module Having Vertical Metallic Contacts and a Method for Fabricating the Same
Infineon Technologies Austria AG
0 cites - US120027392024Semiconductor Device Including an Embedded Semiconductor Die
Infineon Technologies Austria AG
0 cites - US119844162024Device for Controlling Trapped Ions and Method of Manufacturing the Same
Infineon Technologies Austria AG
0 cites - US119554072024Electronic Module Including a Semiconductor Package Connected to a Fluid Heatsink
Infineon Technologies Austria AG
0 cites - US119554152024Semiconductor Device Package Comprising a Pin in the Form of a Drilling Screw
Infineon Technologies Austria AG
0 cites - US119159992024Semiconductor Device Having a Carrier, Semiconductor Chip Packages Mounted on the Carrier and a Cooling Element
Infineon Technologies AG
0 cites - US118625822024Package with Elevated Lead and Structure Extending Vertically from Encapsulant Bottom
Infineon Technologies AG
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- US117216162023Semiconductor Package with Signal Distribution Element
Infineon Technologies Austria AG
0 cites - US117157192023Semiconductor Package and Method of Forming a Semiconductor Package
Infineon Technologies AG
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- US116887132023Additive Manufacturing of a Frontside or Backside Interconnect of a Semiconductor Die
Infineon Technologies Austria AG
0 cites - US116005582023Plurality of Transistor Packages with Exposed Source and Drain Contacts Mounted on a Carrier
Infineon Technologies AG
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