Martin Benisek

3 Patents

• US124313672025

  Embedded Package with Shielding Pad

  Infineon Technologies AG

  0 cites
• US119031322024

  Power Electronic Assembly Having a Laminate Inlay and Method of Producing the Power Electronic Assembly

  Infineon Technologies AG

  0 cites
• US116328602023

  Power Electronic Assembly and Method of Producing Thereof

  Infineon Technologies AG

  0 cites