6 Patents
- US125819832026Semiconductor Module Comprising a Semiconductor and Comprising a Shaped Metal Body That Is Electrically Contacted by the Semiconductor
DANFOSS SILICON POWER GmbH
0 cites - 0 cites
- US124209642025Apparatus and Method for Packaging Slab Form or Cuboidal Products
LOESCH VERPACKUNGSTECHNIK GmbH + Co. KG
0 cites - 0 cites
- US121258172024Semiconductor Module with a First Substrate, a Second Substrate and a Spacer Separating the Substrates from Each Other
DANFOSS SILICON POWER GmbH
0 cites - US120465762024Pressure Sintering Device and Method for Manufacturing an Electronic Component
DANFOSS SILICON POWER GmbH
0 cites