7 Patents
- US125325382026Integrated Circuit Structures Having Conductive Structures in Fin Isolation Regions
Intel Corporation
0 cites - US124762052025Rectilinear Seams Between Adjacent Fields of a Die for Improved Layout Efficiency
Intel Corporation
0 cites - 0 cites
- 0 cites
- US120516922024Integrated Circuit Structure with Front Side Signal Lines and Backside Power Delivery
Intel Corporation
0 cites - 0 cites
- US116826642023Standard Cell Architecture with Power Tracks Completely Inside a Cell
Intel Corporation
0 cites