Patents/Inventors

Markus Wimplinger

Ried im InnkreisAT11 patents

11 Patents

US124678502025
Device and Method for Measuring a Substrate
EV GROUP E. THALLNER GmbH
0 cites
US124567202025
Method for Bonding of Chips
EV Group E. Thallner GmbH
0 cites
US121355002024
Stamp and Method for Embossing
EV Group E. Thallner GmbH
0 cites
US121070572024
Method for Permanent Connection of Two Metal Surfaces
EV GROUP E. THALLNER GmbH
0 cites
US119904632024
Device for Bonding Chips
EV Group E. Thallner GmbH
0 cites
US118624872024
Device and Method for Bonding of Two Substrates
EV Group E. Thallner GmbH
0 cites
US117768422023
Method and Device for Surface Treatment of Substrates
EV Group E. Thallner GmbH
0 cites
US117641982023
Method and Device for Bonding of Chips
EV Group E. Thallner GmbH
0 cites
US117568182023
Accommodating Device for Retaining Wafers
EV Group E. Thallner GmbH
0 cites
US116972812023
Device and Method for Bonding Substrates
EV Group E. Thallner GmbH
0 cites
US115629122023
Device and Method for Bonding of Two Substrates
EV Group E. Thallner GmbH
0 cites