Markus Dinkel

6 Patents

• US125463612026

  Method for Producing a Rolling Bearing Component

  Schaeffler Technologies AG & Co. KG

  0 cites
• US123083392025

  Method of Manufacturing a Package Using a Clip Having at Least One Locking Recess

  Infineon Technologies AG

  0 cites
• US119159992024

  Semiconductor Device Having a Carrier, Semiconductor Chip Packages Mounted on the Carrier and a Cooling Element

  Infineon Technologies AG

  0 cites
• US117768822023

  Method of Fabricating a Semiconductor Package

  Infineon Technologies Austria AG

  0 cites
• US117283092023

  Clip Having Locking Recess for Connecting an Electronic Component with a Carrier in a Package

  Infineon Technologies AG

  0 cites
• US116005582023

  Plurality of Transistor Packages with Exposed Source and Drain Contacts Mounted on a Carrier

  Infineon Technologies AG

  0 cites