Patents/Inventors

Mark Pavier

East GrinsteadGB4 patents

5 Patents

US124993432025
Wafer-level Package Sensor Device
Infineon Technologies AG
0 cites
US120682742024
Semiconductor Die Being Connected with a Clip and a Wire Which Is Partially Disposed Under the Clip
Infineon Technologies AG
0 cites
US120634742024
Methods of Environmental Protection for Silicon MEMS Structures in Cavity Packages
INFINEON TECHNOLOGIES AG
0 cites
US120573762024
Three Level Interconnect Clip
Infineon Technologies AG
0 cites
US116091802023
Emitter Package for a Photoacoustic Sensor
Infineon Technologies AG
0 cites