Mark K. Hoffmeyer

9 Patents

• US124576932025

  Applying a Solderable Surface to Conductive Ink

  International Business Machines Corporation

  0 cites
• US124395422025

  Standoff and Support Structures for Reliable Land Grid Array and Hybrid Land Grid Array Interconnects

  International Business Machines Corporation

  0 cites
• US120161272024

  Liquid Metal Infiltration Rework of Electronic Assembly

  International Business Machines Corporation

  0 cites
• US118056032023

  Applying a Solderable Surface to Conductive Ink

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US117844242023

  Reliability Enhancement of Press Fit Connectors

  International Business Machines Corporation

  0 cites
• US117741902023

  Pierced Thermal Interface Constructions

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US117513692023

  Liquid Metal Infiltration Rework of Electronic Assembly

  International Business Machines Corporation

  0 cites
• US117039222023

  Thermal Interface Material Structures for Directing Heat in a Three-dimensional Space

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US116643022023

  Integrated Circuit Module with a Structurally Balanced Package Using a Bottom Side Interposer

  International Business Machines Corporation

  0 cites