Patents/Inventors

Mark J. Beesley

Carmel Valley, CAUS2 patents

3 Patents

US123762312025
Three-dimensional (3D) Copper in Printed Circuit Boards
Apple Inc.
0 cites
US120354662024
Systems and Methods for Manufacturing Thin Substrate
Apple Inc.
0 cites
US119568982024
Three-dimensional (3D) Copper in Printed Circuit Boards
Apple Inc.
0 cites