Mark D. Schultz

8 Patents

• US126223182026

  Wafer to Wafer High Density Interconnects

  International Business Machines Corporation

  0 cites
• US121583142024

  Reduced Pressure Drop Cold Plate Transition

  International Business Machines Corporation

  0 cites
• US120289972024

  Rotating Lid for Module Cooler

  International Business Machines Corporation

  0 cites
• US120043222024

  Cold Plate with Uniform Plenum Flow

  International Business Machines Corporation

  0 cites
• US119232692024

  Co-packaged Optical Module

  International Business Machines Corporation

  0 cites
• US118006662023

  Temporary Removable Module Lid

  International Business Machines Corporation

  0 cites
• US117372482023

  Data Center Coolant Switch

  International Business Machines Corporation

  0 cites
• US116982332023

  Reduced Pressure Drop Cold Plate Transition

  International Business Machines Corporation

  0 cites