9 Patents
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- US117496632023Device, Method and System for Providing a Stacked Arrangement of Integrated Circuit Dies
Intel Corporation
0 cites - US116520602023Die Interconnection Scheme for Providing a High Yielding Process for High Performance Microprocessors
Intel Corporation
0 cites - US116521072023Substrate-less Finfet Diode Architectures with Backside Metal Contact and Subfin Regions
Intel Corporation
0 cites - 0 cites