Patents/Inventors

Mariano Layson Ching, Jr.

TianjinCN1 patent

2 Patents

US119844082024
Cavity Formed in a Molding Compound of a Semiconductor Package to Reduce Mechanical Stress on a Portion of a Die in the Package, and Methods of Formation
NXP USA, Inc.
0 cites
US119232752024
Lead-frame Assembly, Semiconductor Package and Methods for Improved Adhesion
NXP USA, Inc.
0 cites