Marcus Hsu

4 Patents

• US125001872025

  Package Comprising an Interconnection Die Located Between Substrates

  QUALCOMM INCORPORATED

  0 cites
• US117841512023

  Redistribution Layer Connection

  QUALCOMM INCORPORATED

  0 cites
• US116826072023

  Package Having a Substrate Comprising Surface Interconnects Aligned with a Surface of the Substrate

  QUALCOMM INCORPORATED

  0 cites
• US115520232023

  Passive Component Embedded in an Embedded Trace Substrate (ETS)

  QUALCOMM Incorporated

  0 cites