10 Patents
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- US121348342024Composition for Copper Bump Electrodeposition Comprising a Polyaminoamide Type Leveling Agent
BASF SE
0 cites - US120984732024Composition for Cobalt Plating Comprising Additive for Void-free Submicron Feature Filling
BASF SE
0 cites - 0 cites
- US119269182024Composition for Metal Plating Comprising Suppressing Agent for Void Free Filing
BASF SE
0 cites - 0 cites
- 0 cites