Marcel B. Wieland

2 Patents

• US119076232024

  Chip Module Structure and Method and System for Chip Module Design Using Chip-package Co-optimization

  Globalfoundries Dresden Module One Limited Liability Company & Co. KG

  0 cites
• US115574212023

  Integrated Circuit Structure with Dielectric Material to Cover Horizontally Separated Metal Layers, and Related Method

  Globalfoundries Dresden Module One Limited Liability Company & Co. KG

  0 cites