4 Patents
- US124380672025Flip Chip Self-alignment Features for Substrate and Leadframe Applications and Method of Manufacturing the Flip Chip Self-alignment Features
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US120628332024Packaged Electronic Device Having Integrated Antenna and Locking Structure
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US116771352023Packaged Electronic Device Having Integrated Antenna and Locking Structure
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US116580992023Flip Chip Curved Sidewall Self-alignment Features for Substrate and Method for Manufacturing the Self-alignment Features
Amkor Technology Singapore Holding Pte. Ltd.
0 cites