Mao Takeda

1 Patent

• US124863712025

  Thermally Curable Resin Composition, Cured Object, Resin Sheet, Prepreg, Metal-clad Laminate, Multilayered Printed Wiring Board, Sealing Material, Fiber-reinforced Composite Material, Adhesive, and Semiconductor Device

  NIPPON KAYAKU KABUSHIKI KAISHA

  0 cites