Manuel Aldrete

3 Patents

• US126108692026

  Integrated Circuit (IC) Package Employing a Metal Block with Metal Interconnects Thermally Coupling a Die to an Interposer Substrate for Dissipating Thermal Energy of the Die, and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US124631272025

  Integrated Circuit (IC) Package Employing a Re-distribution Layer (RDL) Substrate(s) with Photosensitive Dielectric Layer(s) for Increased Package Rigidity, and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US118044282023

  Mixed Pad Size and Pad Design

  QUALCOMM INCORPORATED

  0 cites