30 Patents
- US125819272026Contact Over Active Gate Structures with Conductive Trench Contact Taps for Advanced Integrated Circuit Structure Fabrication
Intel Corporation
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- US124827442025Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites - US124009132025Contact Over Active Gate Structures with Conductive Trench Contact Taps for Advanced Integrated Circuit Structure Fabrication
Intel Corporation
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- US122665272025Directed Self-assembly Enabled Patterning Over Metal Layers Using Assisting Features
Intel Corporation
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- US122372232025Contact Over Active Gate Structures Using Directed Self-assembly for Advanced Integrated Circuit Structure Fabrication
Intel Corporation
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- US121762142024Selective Metal Removal for Conductive Interconnects in Integrated Circuitry
Intel Corporation
0 cites - US121319912024Self Aligned Gratings for Tight Pitch Interconnects and Methods of Fabrication
Intel Corporation
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- US120878362024Contact Over Active Gate Structures with Metal Oxide-caped Contacts to Inhibit Shorting
Intel Corporation
0 cites - US120806392024Contact Over Active Gate Structures with Metal Oxide Layers to Inhibit Shorting
Intel Corporation
0 cites - US120274582024Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites - US119904032024Dielectric Helmet-based Approaches for Back End of Line (BEOL) Interconnect Fabrication and Structures Resulting Therefrom
Intel Corporation
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- US118942702024Grating Replication Using Helmets and Topographically-selective Deposition
Intel Corporation
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- US118375422023Interconnects Having a Portion Without a Liner Material and Related Structures, Devices, and Methods
Intel Corporation
0 cites - US118376442023Contact Over Active Gate Structures with Metal Oxide-caped Contacts to Inhibit Shorting
Intel Corporation
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- US116643052023Staggered Lines for Interconnect Performance Improvement and Processes for Forming Such
Intel Corporation
0 cites - US115575362023Integrated Circuits (ic's) with Electro-migration (em)—resistant Segments in an Interconnect Level
Intel Corporation
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