Patents/Inventors

Makoto Yoshino

TokyoJP20 patents

20 Patents

US125801182026
Multi-layer Inductor
TDK CORPORATION
0 cites
US125122422025
Multilayer Coil Component
TDK CORPORATION
0 cites
US124007852025
Multi-layer Coil Component
TDK CORPORATION
0 cites
US123475962025
Multi-layer Inductor
TDK CORPORATION
0 cites
US123475972025
Multi-layer Inductor
TDK CORPORATION
0 cites
US123476072025
Multi-layer Coil Component
TDK CORPORATION
0 cites
US123342472025
Multi-layer Coil Component
TDK CORPORATION
0 cites
US123004232025
Multi-layer Coil Component
TDK CORPORATION
0 cites
US121256272024
Multilayer Inductor Component
TDK CORPORATION
0 cites
US120946422024
Multilayer Inductor Component
TDK CORPORATION
0 cites
US120801422024
Information Presentation Method, Information Presentation System, and Information Presentation Apparatus
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites
US120465422024
Heat-dissipating Wirebonded Members on Package Surfaces
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120401222024
Multilayer Coil Component
TDK CORPORATION
0 cites
US120210192024
Semiconductor Device Package with Thermal Pad
TEXAS INSTRUMENTS INCORPORATED
0 cites
US118941952024
Electronic Component
TDK CORPORATION
0 cites
US118306642023
Multilayer Coil Component
TDK CORPORATION
0 cites
US117910882023
Multilayer Coil Component
TDK CORPORATION
0 cites
US117353472023
Multilayer Coil Component
TDK CORPORATION
0 cites
US116107092023
Electronic Component
TDK CORPORATION
0 cites
US115690202023
Coil Component
TDK CORPORATION
0 cites