Patents/Inventors

Makoto Shibuya

BeppuJP27 patents

20 Patents

US126186102026
Refrigerator
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125819802026
IC Package with Field Effect Transistor
TEXAS INSTRUMENTS INCORPORATED
0 cites
US125352622026
Refrigerator
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125327862026
Semiconductor Device Package with Vertically Stacked Passive Component
TEXAS INSTRUMENTS INCORPORATED
0 cites
US124567072025
Stacked Clip Design for Gan Half Bridge IPM
TEXAS INSTRUMENTS INCORPORATED
0 cites
US122726262025
Conductive Members Atop Semiconductor Packages
TEXAS INSTRUMENTS INCORPORATED
0 cites
US122305392025
Wafer Chip Scale Packaging with Ball Attach Before Repassivation
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121192632024
Methods and Apparatus for an Improved Integrated Circuit Package
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120465422024
Heat-dissipating Wirebonded Members on Package Surfaces
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120402602024
Electronic Package with Surface Contact Wire Extensions
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119554562024
Flip Chip Packaged Devices with Thermal Pad
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119423842024
Semiconductor Package Having an Interdigitated Mold Arrangement
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119335332024
Blower and Refrigerator
Samsung Electronics Co., Ltd.
0 cites
US118482442023
Leaded Wafer Chip Scale Packages
Texas Instruments Incorporated
0 cites
US118429522023
Double Side Heat Dissipation for Silicon Chip Package
Texas Instruments Incorporated
0 cites
US117641422023
Semiconductor Apparatus and Method Having a Lead Frame with Floating Leads
TEXAS INSTRUMENTS INCORPORATED
0 cites
US117258642023
Refrigerator
Samsung Electronics Co., Ltd.
0 cites
US116560212023
Refrigerator
Samsung Electronics Co., Ltd.
0 cites
US116010652023
Power Converter Module
TEXAS INSTRUMENTS INCORPORATED
0 cites
US115748552023
Package with Dies Mounted on Opposing Surfaces of a Leadframe
TEXAS INSTRUMENTS INCORPORATED
0 cites