12 Patents
- US124179112025Method and System for Forming Silicon Nitride Layer Using Low Radio Frequency Plasma Process
ASM IP Holding B.V.
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- US121096252024Surface-coated Tin-based Cermet Cutting Tool in Which Hard Coating Layer Exhibits Excellent Chipping Resistance
MITSUBISHI MATERIALS CORPORATION
0 cites - US120312052024Method and System for Forming a Conformal Silicon Carbon Nitride Layer and Structure Formed Using Same
ASM IP Holding B.V.
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- US118507282023Reception Apparatus, Reception System, Reception Method, and Storage Medium
NEC CORPORATION
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