Patents/Inventors

Maki Yonetsu

MitakaJP9 patents

8 Patents

US124314062025
Bonded Body, Circuit Board, Semiconductor Device, and Method for Manufacturing Bonded Body
TOSHIBA MATERIALS CO., Ltd.
0 cites
US123438202025
Brazing Material, Bonded Body, Ceramic Circuit Board, and Method for Manufacturing Bonded Body
TOSHIBA MATERIALS CO., Ltd.
0 cites
US123477442025
Bonded Body Including Titanium Alloy at Bonding Boundary
TOSHIBA MATERIALS CO., Ltd.
0 cites
US123083012025
Structure and Bonded Body
KABUSHIKI KAISHA TOSHIBA
0 cites
US121609592024
Bonded Body, Ceramic Copper Circuit Board, Method for Manufacturing Bonded Body, and Method for Manufacturing Ceramic Copper Circuit Board
TOSHIBA MATERIALS CO., Ltd.
0 cites
US121156032024
Bonded Body, Ceramic Copper Circuit Substrate, and Semiconductor Device
TOSHIBA MATERIALS CO., Ltd.
0 cites
US119489002024
Bonded Body, Circuit Board, and Semiconductor Device
TOSHIBA MATERIALS CO., Ltd.
0 cites
US117299072023
Structure and Circuit Board
KABUSHIKI KAISHA TOSHIBA
0 cites