Mahadi-ul Hassan

2 Patents

• US123158352025

  Pre-packaged Chip, Method of Manufacturing a Pre-packaged Chip, Semiconductor Package and Method of Manufacturing a Semiconductor Package

  Infineon Technologies AG

  0 cites
• US122847532025

  Electrostatic Discharge Protection of Electronic Component Embedded in Laminate of Printed Circuit Board

  Infineon Technologies AG

  0 cites