Madhava Rao Yalamanchili

3 Patents

• US121319522024

  Wafer Dicing Using Femtosecond-based Laser and Plasma Etch

  Applied Materials, Inc.

  0 cites
• US119159322024

  Plasma Etching of Mask Materials

  Applied Materials, Inc.

  0 cites
• US116211942023

  Wafer Dicing Using Femtosecond-based Laser and Plasma Etch

  Applied Materials, Inc.

  0 cites