3 Patents
- US121609482024Integrating Graphene Into the Skin Depth Region of High Speed Communications Signals for a Printed Circuit Board
CISCO TECHNOLOGY, Inc.
0 cites - US120740812024Use of Bimetals in a Heat Sink to Benefit Heat Transfer from High Temperature Integrated Circuit Components on a Circuit Board
CISCO TECHNOLOGY, Inc.
0 cites - US117513222023Integrating Graphene Into the Skin Depth Region of High Speed Communications Signals for a Printed Circuit Board
CISCO TECHNOLOGY, Inc.
0 cites