2 Patents
- US125884702026Methods for Assembling Stacked Substrate Packages Including Dies, Laminated Base Substrates, and Dielectric Build-up Substrates
MARVELL ASIA PTE Ltd
0 cites - US121990032025Packaging Stacked Substrates and an Integrated Circuit Die Using a Lid and a Stiffening Structure
Marvell Asia PTE Ltd.
0 cites