Patents/Inventors

Longnan Jin

TianjinCN1 patent

2 Patents

US118760032024
Semiconductor Package and Packaging Process for Side-wall Plating with a Conductive Film
VISHAY GENERAL SEMICONDUCTOR, LLC
0 cites
US117640752023
Package Assembly for Plating with Selective Molding
VISHAY GENERAL SEMICONDUCTOR, LLC
0 cites