Loke Yip Foo

4 Patents

• US122372452025

  Face-to-face Through-silicon via Multi-chip Semiconductor Apparatus with Redistribution Layer Packaging and Methods of Assembling Same

  Altera Corporation

  0 cites
• US121257682024

  Face-to-face Through-silicon via Multi-chip Semiconductor Apparatus with Redistribution Layer Packaging and Methods of Assembling Same

  Altera Corporation

  0 cites
• US118056022023

  Chip Assemblies

  Intel Corporation

  0 cites
• US115629592023

  Embedded Dual-sided Interconnect Bridges for Integrated-circuit Packages

  Intel Corporation

  0 cites