Patents/Inventors

Loic Sanchez

GrenobleFR1 patent

2 Patents

US124631742025
Method for Bonding Chips to a Substrate by Direct Bonding
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
0 cites
US116949912023
Method for Transferring Chips
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
0 cites