Patents/Inventors

Lizabeth Keser

San Diego, CAUS13 patents

9 Patents

US126223192026
Stacked Die Packaging Architecture with Conductive Vias on Interposer
Intel Corporation
0 cites
US124761762025
Glass Core Substrate Printed Circuit Board for Warpage Reduction
Intel Corporation
0 cites
US123746252025
Microelectronic Assemblies Having Topside Power Delivery Structures
Intel Corporation
0 cites
US123622512025
Fan Out Package with Integrated Peripheral Devices and Methods
Intel Corporation
0 cites
US122438282025
Microelectronic Assemblies Having Topside Power Delivery Structures
Intel Corporation
0 cites
US122117962025
Microelectronic Assemblies Having Topside Power Delivery Structures
Intel Corporation
0 cites
US120573642024
Package Formation Methods Including Coupling a Molded Routing Layer to an Integrated Routing Layer
Intel Corporation
0 cites
US119553952024
Fan Out Package with Integrated Peripheral Devices and Methods
Intel Corporation
0 cites
US115812872023
Chip Scale Thin 3D Die Stacked Package
Intel Corporation
0 cites