5 Patents
- US126108262026Wafer-level Chip Structure, Multiple-chip Stacked and Interconnected Structure and Fabricating Method Thereof
NATIONAL CENTER FOR ADVANCED PACKAGING CO., Ltd.
0 cites - US126047302026Chip Packaging Structure and Preparation Method Therefor
SHANGHAI XIANFANG SEMICONDUCTOR CO., Ltd.
0 cites - US125123922025Package Structure for Reducing Warpage of Plastic Package Wafer and Method for Manufacturing the Same
SHANGHAI XIANFENG SEMICONDUCTOR CO., Ltd
0 cites - US118547942023Semiconductor Cleaning Equipment and Method for Cleaning Through Vias Using the Same
NATIONAL CENTER FOR ADVANCED PACKAGING CO., Ltd.
0 cites - 0 cites