3 Patents
- US125507872026Bonded Assembly Containing Bonding Pads with Metal Oxide Barriers and Methods for Forming the Same
Sandisk Technologies, Inc.
0 cites - US124128542025Semiconductor Devices Containing Copper Bonding Pads with Different Conductive Barrier Layers and Methods for Forming the Same
Sandisk Technologies, Inc.
0 cites - US119904132024Three-dimensional Memory Device Including Aluminum Alloy Word Lines and Method of Making the Same
SANDISK TECHNOLOGIES LLC
0 cites