Patents/Inventors

Lina Jiang

GuangdongCN3 patents

4 Patents

US124762302025
Embedded Packaging Structure and Method for Manufacturing the Same
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites
US124630552025
Package Substrate Manufacturing Method
NEXPERIA B.V.
0 cites
US118221212023
Cavity Substrate Having Directional Optoelectronic Transmission Channel and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites
US115793622023
Cavity Substrate Having Directional Optoelectronic Transmission Channel and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites