Patents/Inventors

Lin Hou

BeijingCN19 patents

17 Patents

US126105812026
Amorphous Silicon Thin-film Transistor, Method for Preparing Same, and Display Panel
BOE TECHNOLOGY GROUP CO., Ltd.
0 cites
US125935082026
Display Substrate, Display Substrate Motherboard and Display Apparatus
BOE Technology Group Co., Ltd.
0 cites
US124430822025
Display Substrate, Display Device and Motherboard
BOE Technology Group Co., Ltd.
0 cites
US124128542025
Semiconductor Devices Containing Copper Bonding Pads with Different Conductive Barrier Layers and Methods for Forming the Same
Sandisk Technologies, Inc.
0 cites
US123478042025
Bonded Assembly Including Interconnect-level Bonding Pads and Methods of Forming the Same
Sandisk Technologies, Inc.
0 cites
US122612272025
Thin Film Transistor, Display Substrate and Display Device with Reduced Leakage Current
BOE TECHNOLOGY GROUP CO., Ltd.
0 cites
US121258142024
Bonded Assembly Containing Different Size Opposing Bonding Pads and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites
US120265032024
Device of Updating Library Required by Testing Program for Testing and Method Thereof
Inventec Corporation
0 cites
US119489022024
Bonded Assembly Including an Airgap Containing Bonding-level Dielectric Layer and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites
US118698772024
Bonded Assembly Including Inter-die via Structures and Methods for Making the Same
SANDISK TECHNOLOGIES LLC
0 cites
US117912782023
Display Substrate Motherboard and Manufacturing Method Thereof, Display Substrate and Display Apparatus
BOE Technology Group Co., Ltd.
0 cites
US117107472023
Array Substrate, Manufacturing Method Thereof, and Display Device
BOE TECHNOLOGY GROUP CO., Ltd.
0 cites
US116462822023
Bonded Semiconductor Die Assembly with Metal Alloy Bonding Pads and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites
US116462832023
Bonded Assembly Containing Low Dielectric Constant Bonding Dielectric Material
SANDISK TECHNOLOGIES LLC
0 cites
US116371342023
Array Substrate, Method for Manufacturing the Same, and Display Device
BOE TECHNOLOGY GROUP CO., Ltd.
0 cites
US115629752023
Bonded Assembly Employing Metal-semiconductor Bonding and Metal-metal Bonding and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites
US115479432023
Providing Social Network Content in Games
Zynga Inc.
0 cites