Patents/Inventors

Lily Zhao

San Diego, CAUS7 patents

8 Patents

US125001882025
Flip-chip Bumping Metal Layer and Bump Structure
QUALCOMM INCORPORATED
0 cites
US124698112025
Package Comprising Wire Bonds Coupled to Integrated Devices
QUALCOMM INCORPORATED
0 cites
US123459362025
Building Control Device with a Light Guide Configured for Uniformly Illuminating a Graphical Symbol That Is Visible to a User of the Building Control Device
HONEYWELL INTERNATIONAL Inc.
0 cites
US122821872025
Building Control Device with a Light Guide Configured for Uniformly Illuminating a Graphical Symbol That Is Visible to a User of the Building Control Device
HONEYWELL INTERNATIONAL Inc.
0 cites
US121130382024
Thermal Compression Flip Chip Bump for High Performance and Fine Pitch
QUALCOMM Incorporated
0 cites
US119489092024
Package Comprising Spacers Between Integrated Devices
QUALCOMM INCORPORATED
0 cites
US116949822023
Sidewall Wetting Barrier for Conductive Pillars
QUALCOMM INCORPORATED
0 cites
US115575572023
Flip-chip Flexible Under Bump Metallization Size
QUALCOMM INCORPORATED
0 cites